CyberRota Analysis
AI-GeneratedThe vulnerability in the Linux kernel affects the thermal management subsystem, specifically related to the handling of On-Demand Voltage and Power (ODVP) files during probe failures. If not addressed, this issue can lead to resource leaks, potentially impacting system stability and thermal management efficiency. Organizations using affected Linux distributions should prioritize this fix to ensure optimal performance and reliability of their thermal management systems.
Original NVD Description
In the Linux kernel, the following vulnerability has been resolved: thermal: intel: int3400: clean up ODVP on probe failures evaluate_odvp() creates per-ODVP sysfs files before the thermal zone and later probe resources are registered. The current unwind path only calls cleanup_odvp() from the late sysfs failure path, so failures after evaluate_odvp() but before that label, including thermal_tripless_zone_device_register() failures, leave the ODVP files and storage behind. Move the ODVP cleanup to the common ART/TRT unwind path so every failure after evaluate_odvp() releases the ODVP state. Also clear the cached ODVP pointers in cleanup_odvp(), because evaluate_odvp() can already call it for partial setup failures while probe continues.